However, a key challenge with semiconductor lasers is thermal management as these devices generate a significant amount of heat. 80Au20Sn is commonly used with high output lasers due to its good thermal conductivity, high sheer, yield, and tensile strength, excellent wettability, and resistance to corrosion. One of the most highly demanded applications for 80Au20Sn is in semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products. 80Au20Sn is a great choice to ensure good performance and reliability due to its eutectic melting point of 280☌. Thermal requirements of semiconductor laser technologies often mandate the use of a high-melting die-attach solder. Voiding percentages were defined for several 80Au20Sn preform thicknesses – ranging from 0.002” to 0.00035” thick – allowing for conclusions to be drawn on the effect of 80Au20Sn preform thickness on thermal transfer in semiconductor laser technologies. The creation of voiding hot spots – due to the lack of solder volume – is a perceived concern when using a thinner preform in the solder joint, which then contradicts the original intention. One option to improve thermal transfer is the use a thinner 80Au20Sn preform in the bondline, which allows the heat to transfer to the heat sink more quickly and efficiently. When the operational heat of these devices increases, their longevity and potential become limited.

However, difficulty managing thermal heat transfer has prevented the widespread use of semiconductor lasers. For the plethora of applications that require a high-melting die-attach solder, 80Au20Sn is a great choice to ensure good performance and reliability, especially when used in one of its most highly demanded applications: semiconductor laser die-attach.

Ausn preforms